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GB15 Wafer Handling Robot
GB15 Wafer Handling Robot
 

GB15 Wafer Handling Robot

  • Extended vertical travel wafer handler for 300 mm wafers.
  • Direct-drive swapping mechanism with minimized height
  • Maximized ratio between the effective vertical stroke and the robot-height
  • Excellent choice for performing material handling in processing tools with stacked-up process modules, e.g. vertical furnaces, etc. Provides interface (material handoff) between GB12 robots in multi-layer processing tools
  • Fast wafer swap (< 2.8 sec) under specific conditions

Specifications:

Configuration  
Wafer Size 300mm
Degrees of freedom
(Number of axes)		 4
Axes Z, T, R1, R2
End Effectors Types Vacuum
Wafer Mapping N/A
Physical Properties  
Minimum robot height
(at the lowest Z-axis position)		 400 mm
Maximum robot height
(at the highest Z-axis position)		 2100 mm
Effective Range of Motion Z: 1490 mm
T: 290 degrees
R1: 449 mm
R2: 449 mm
Performance  
Max Payload 1 kg
Repeatability X: 0.1 mm (3σ)
Z: 0.1 mm (3σ)
T: 0.01° (3σ)
R1: 0.1 mm (3σ)
R2: 0.1 mm (3σ)
Environment
Cleanliness		 ISO Class 3 Compatible
Standards Compliance  
Applicable Directives/Standards Machine Directive 89/392/EEC
Low Voltage Directive 73/23/EEC
89/336/EEC(EMC)
SEMI S2-93A
Standards to Verify Compliance EN 60204-1:1997
EN 55011
EN ISO 12100-2:2003
RIA R15.06:1999
Reliability  
Reliability per SEMI E10 MCBF >15M
MTBF >100000 h