GB14 Wafer Handling Robot

Compact, high performance wafer handler for 300 mm wafers.
Direct-drive swapping mechanism with minimized height
Maximized ratio between the effective vertical stroke and the robot-height
Fast wafer swap (< 2.8 sec) under specific conditions
Designed for wafer handling within vertical profile (minimized vertical size) processing tools
An excellent automation choice for multi-layer processing tools with stacked process modules
Edge-gripping

Configuration
Wafer Size	300mm
Degrees of freedom (Number of axes)	5
Axes	X, Z, T, R1, R2
End Effectors Types	Vacuum
Wafer Mapping	N/A
Physical Properties
Minimum robot height (at the lowest Z-axis position)	433 mm
Maximum robot height (at the highest Z-axis position)	933 mm
Effective Range of Motion	X: 1390 mm Z: 500 mm T: 290 degrees R1: 449 mm R2: 449 mm
Performance
Max Payload	1 kg
Repeatability	X: 0.1 mm (3σ) Z: 0.1 mm (3σ) T: 0.01° (3σ) R1: 0.1 mm (3σ) R2: 0.1 mm (3σ)
Environment Cleanliness	ISO Class 2 Compatible
Standards Compliance
Applicable Directives/Standards	Machine Directive 89/392/EEC Low Voltage Directive 73/23/EEC 89/336/EEC(EMC) SEMI S2-93A
Standards to Verify Compliance	EN 60204-1:1997 EN 55011 EN ISO 12100-2:2003 RIA R15.06:1999
Reliability
Reliability per SEMI E10	MCBF >15M MTBF >100000 h